Organic Solderability Preservative

Surface Finishing

Information

Application：

New-generation selective OSP refers to the product in particular designed for PCB surface coating and adapted to high-temperature lead-free assembly process, applies to full-copper board and copper-gold mixed board, with no film deposition on gold surface, and highly applies to the production of high-density and fine-spacing PCB.

Advantage introduction：

Excellent tin adhesion performance;

Excellent tin climb performance for DIMM through hole;

Good selectivity, no deposition while the gold thickness is relative thin;

Good compatibility for flux;

Good solution stability.

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